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Описание Intel



Product specifications

Form factorSSI EEB (12” x 13”)
Processor support

Support for one or two Intel® Xeon® Processor 5500 and 5600 series processors in FC-LGA 1366 Socket B package with up to 95 W Thermal Design Power (TDP)
Supports future processor compatibility guidelines
4.8 GT/s, 5.86 GT/s, and 6.4 GT/s Intel® QuickPath Interconnect (Intel® QPI)
Meets EVRD11.1

Chipset

Intel® 5500 Chipset IOH
Intel® 82801Jx I/O Controller Hub (ICH10R)

Thermal solutionsIntel® Thermal Solution STS100 series
Intel® QuickPath Technology4.8 GT/s, 5.8 GT/s, and 6.4 GT/s
Memory

DDR3 memory.
8 DIMMs total across six memory channels (three channels per processor in a 2:1:1 configuration)
VRD optimized to support QR x8 DIMMs
No support for QR x4 DIMMs

Memory RAS featuresChannel mirroring, demand scrubbing, patrol scrubbing and channel independent mode
Expansion slots

One PCI 32/33 slot

Two PCI Express* 2.0 x16 bus add-in card connectors

One PCI Express* 2.0 x4 bus add-in card connector

Two PCI Express* 1.1 x1 bus add-in card connectors

Storage6 SATA ports (3 Gbps) via ICH10R with Intel® Embedded Server RAID Technology
RAID support

Intel® Embedded Server RAID Technology II through onboard SATA connectors provides SATA RAID 0, 1, and 10 and optional RAID 5 support provided by the Intel® RAID Activation Key AXXRAKSW5.

Intel® Rapid Storage RAID through onboard SATA connectors provides SATA RAID 0, 1, 5, and 10.

Integrated LAN

Two 10/100/1000 ports provided by Intel® 82576 PHYs with Intel® I/O Acceleration

Technology 2 support

Integrated graphicsOnboard ServerEngines* LLC Pilot II Controller
Matrox* G200 2D Video Graphics controller
Uses 8 MB of the BMC 32 MB DDR2 Memory
Management hardware

The board has several hardware management
features including the following:

Fan monitoring and control

Thermal and voltage monitoring

Chassis intrusion detection

Management softwareIntel® System Management Software
Intel® Deployment Assistant